Capabilities

Facility-Capabilities   

• Pressing Compacts in:

  • Tungsten Carbide

  • Alumina Oxide

  • Zirconia Oxide

• Centerless Grind to 4 Micro Finish (Diameter .005" and Larger)

• Pressing Holes as small as .001" in diameter

• Manufacture:

  • Punches

  • Die Buttons

  • Bushings

  • Stripper Guides

• EDM Holes .001" and larger

• Sintering

• Grinding

• Polishing

• Micro Brazing

Equipment  

• Optical Precision Grinding Machines

• Computer Operated Centerless Grinders

• Computer Operated Cylindrical Grinding Machines

• Crystal Lake Grinders

• Surface Grinders

• Electrical Discharge Machines (EDM)

• Bridgeport Milling Machines

• Micro-Drilling Machines

• Brazing Machines

• Automatic/Semiautomatic Pressing Machines

• Cut-Off Machines

• Lapping Machines

• Planetary Lapping Machines

• Bore Polishing Machines

• Model 2000 Interferometer

Materials   

• High Purity Alumina

• Tungsten Carbide

• Titanium Carbide

• Stainless Steel

• Pure Tungsten

• Molybdenum

• Graphite

• Brass

• Delrin

• Teflon

• Torlon

• Zirconia Oxide

• Vespel

Quality Control  

• Optical Comparators

• Microscopes to 1500x

• Laser Micrometers

• Mechanical Comparators

• Measuring Capabilities as precise as .000010"

Markets   

• Semiconductor Bonding Tools

• Nozzles (Gluing, Spraying, and Painting)

• Micro Drilling

• Probe Needles

• Print Wire

• Print Wire Tungsten

• Fiber Optic Ferrules

• Fiber Optic Connectors

• Cable Assemblies